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Tampere University has been allocated 40 M.€ in funding for implementing the System-in-Package Fabrication (SiPFAB) infrastructure over a duration of five years starting in 2025. The funding is largely allocated to the procurement of comprehensive lines of process equipment enabling packaging, integration and testing of Wide-Band-Gap (WBG) electronic components in fully functional modules and subsystems.

The SiPFAB infrastructure is part of the WBG Consortium, one of the four European Pilot Lines recently designated by the Chips EU Joint Undertaking program, a central growth pilar of the EU Chips Act set to reinforce the competitiveness and resilience of the semiconductor technology base across Europe. The WBG Pilot Line Consortium includes leading European research institutes, including Tampere University (TAU) in Finland, focusing on developing a new generation of electronic components and systems based on GaN and SiC materials.

The SiBFAB infrastructure is a central piece for consolidating and accelerating the development of semiconductor industry in the European Union, in Finland and in the Tampere region. The central goal is to bridge the gap from lab to fab by enabling access to specialized infrastructure to users from academia, industry and research institutions. SiPFAB’s vision is the development of co-design and co-packaging expertise enabling hybrid integration of components based on different material systems and technologies. This extends to System-on-Chip (SoC) and photonic components, which are recognized areas of competence for Tampere University. 

Further information about the European Pilot Lines and SiPFAB infrastructure in Tampere University is available via links.

Tampere University is looking for an Infrastructure Manager for the SiPFAB pilot line

Job description

Are you ready to take on a pivotal role in the new SiPFAB infrastructure? We are looking for an Infrastructure Manager for SiPFAB Pilot Line in the Faculty of Information Technology and Communication Sciences (ITC) at Tampere University. This is a five-year EU-funded project that will be based in the faculty and involves establishing a new microchip packaging line in cleanroom facilities. The goal of the project is to create a fully functional production line and encourage companies to adopt this technology, aiming to accelerate local business development.

We are seeking an Infrastructure Manager to oversee the implementation of the SiPFAB Pilot Line, a critical infrastructure dedicated to developing advanced packaging for emerging semiconductor components and modules. As the Infrastructure Manager, you will be responsible for project management of the SiPFAB infrastructure, leading procurement and networking activities. You will work in co-operation with the SiPFAB Director.

Requirements 

The successful candidate will have experience in leading or managing advanced scientific infrastructures, building organizations, and possess strong networking and negotiation skills. You should have a technical background and understanding of semiconductors and procurement contracts, as well as the ability to communicate with vendors outside of the network and within the EU consortium. Previous experience in semiconductor packaging is considered an advantage, but not required.

We are looking for a candidate with the following qualifications:

• Proven project management skills, involving overseeing all aspects of a project, including planning, project leadership, resource allocation, risk management, and evaluation. A professional certification is a plus.
• Comprehensive understanding of the theoretical aspects of Microchip Technology, technical background in semiconductors preferred
• Experience in procurement: ability to apply procurement laws effectively and a thorough understanding of procurement processes
• Excellent communication and interpersonal skills as well as leadership skills, with the ability to collaborate effectively with all levels of the organization as well as the EU Consortium and other networks outside Tampere University organization
• A master’s degree in engineering with a specialization in a suitable field
• Practical experience and hands-on attitude, strong problem-solving skills and the ability to work independently

Successful completion of the task requires good oral and written English skills. In addition, knowledge of the Finnish language is a considered positive attribute.

We offer

As an infrastructure Manager, you will act in a key role in building the SiPFAB infrastructure that combines an entrepreneurial mindset with solid financial backing and strong support of Tampere University. This position offers the chance to take on a visible role and make a meaningful impact and to be part of driving the Microchip Technology in Tampere. Tampere University is the largest chip technology educator in Finland. Some of its key research and teaching environments include the System-on-Chip (SoC) HUB for developing system-on-chip circuits, the Optoelectronics Research Centre (ORC), and the Laboratory for Future Electronics.

The position will be filled on a permanent basis and we hope our new employee will start on January 1^st, 2025, preferably earlier if possible. All our new employees have a six-month probationary period. 

Salary is based on the level of the job and your personal performance in accordance with the University’s pay system. The initial requirement level of the post is at levels 10-11 for Other Expert and Support Staff. However higher can be agreed based on the successful candidate’s experience and/or performance on an individual basis.

As a member of staff at Tampere University, you will enjoy a range of competitive benefits, such as occupational health care services, flexible work schedule, versatile research infrastructure, modern facilities and a safe and inviting campus area, as well as a personal fund to spend on sports and cultural activities in your free time. You can also find more information about us and working and living Tampere by watching our video: Tampere Higher Education Community - our academic playground.  

Read more about working at Tampere University.  

Tampere is the largest inland city of Finland, and the city is counted among the major academic hubs in the Nordic countries. Tampere region is the most rapidly growing urban area in Finland and home to a vibrant knowledge-intensive entrepreneurial community. The city is an industrial powerhouse that enjoys a rich cultural scene and a reputation as a center of Finland’s information society. Tampere is also surrounded by vivid nature with forests and lakes, providing countless opportunities for easy-to-access outdoor adventures and refreshment throughout the year. 

We will offer you relocation service package from an external service provider to help you settle in Tampere.

Read more about Finland and Tampere: 

• Visit Finland
• This is Finland
• Ministry of Economic Affairs and Employment: Welcome to Finland
• Visit Tampere
• Welcome to Tampere
• International House Tampere

How to apply 

Please submit your application using the University's online application form (link can be found under this advert). Attach your CV indicating the names, positions and contact details of two referees who can support your application to your application. Please also indicate your salary request on the application form, thank you. Please write your application and all the accompanying documentation in English and attach them in PDF format. The deadline for applications has been extended till October 21st, 2024(at 23.59 EEST, UTC+3).

For more information, please contact

• Tampere University and Tampere region chip strategy: Vice president Jarmo Takala, ++358405416897, jarmo.takala@tuni.fi
• ITC Faculty, Dean Jyrki Vuorinen, +358408490110, jyrki.vuorinen@tuni.fi
• Additional information is given also by our recruitment service provider MPS, Senior Executive Search Consultant Juha-Pekka Suonikko jukka-pekka.suonikko@mps.fi, +358 40 862 2351, 1.10 and 2.10, at 10-12 o’clock (EEST).

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Tampereen yliopisto ja Tampereen ammattikorkeakoulu muodostavat yhdessä Suomen toiseksi suurimman monitieteisen, innostavan ja vaikuttavan tutkimus- ja oppimisyhteisön. Korkeakouluyhteisömme osaamiskärjet ovat tekniikka, terveys ja yhteiskunta. Lue lisää: www.tuni.fi

Tampereen yliopistossa on haettavana Infrastruktuuripäällikön (SiPFAB sirujen paketointipilottilinja) tehtävä.

HAKUOHJEET

Lue tarkemmat tiedot tehtävästä ja hakuohjeet yllä olevasta englanninkielisestä ilmoituksesta.

Jätäthän hakemuksesi yliopiston sähköisellä hakulomakkeella (linkki löytyy tämän ilmoituksen alta). Liitä hakemukseesi ansioluettelosi, johon on merkitty kahden suosittelijan nimet, tehtävänimikkeet ja yhteystiedot. Ilmoitathan hakulomakkeella myös palkkatoiveesi, kiitos. Kirjoita hakemuksesi ja kaikki siihen liittyvät asiakirjat englanniksi ja liitä ne PDF-muodossa. Hakuaikaa tehtävään on jatkettu 21.10.2024 (klo 23.59 EEST, UTC+3) asti.